U.S. Patents

This patent covers a systematic design method and apparatus for connecting rectangular waveguide structures to air-filled substrate integrated waveguides at millimeter wave frequencies. The innovation addresses one of the most technically demanding interfaces in high-frequency RF hardware by replacing iterative trial-and-error design approaches with analytical equations, enabling engineers to build wide-band transitions correctly from first principles.

This patent covers a millimeter wave connection device enabling efficient signal transfer between rectangular waveguide and substrate integrated waveguide structures. The device targets the high-frequency integration challenge of connecting conventional rectangular waveguide hardware to planar SIW-based circuits, addressing signal loss and mismatch issues that arise at millimeter wave frequencies.